{"product_id":"reliability-prediction-for-microelectronics-quality-and-reliability-engineering-series-1st-edition","title":"Reliability Prediction for Microelectronics (Quality and Reliability Engineering Series) 1st Edition","description":"\u003cdiv id=\"bookDescription_feature_div\" class=\"celwidget\" data-feature-name=\"bookDescription\" data-csa-c-type=\"widget\" data-csa-c-content-id=\"bookDescription\" data-csa-c-slot-id=\"bookDescription_feature_div\" data-csa-c-asin=\"191416119X\" data-csa-c-is-in-initial-active-row=\"false\" data-csa-c-id=\"v2qtpm-il6e8f-7s3rfn-6dqbo1\" data-cel-widget=\"bookDescription_feature_div\"\u003e\n\u003cdiv data-a-expander-name=\"book_description_expander\" data-a-expander-collapsed-height=\"280\" class=\"a-expander-collapsed-height a-row a-expander-container a-spacing-base a-expander-partial-collapse-container\"\u003e\n\u003cdiv data-expanded=\"false\" class=\"a-expander-content a-expander-partial-collapse-content\"\u003e\n\u003cdiv data-cel-widget=\"bookDescription_feature_div\" data-csa-c-id=\"vdza35-7pewfj-mdn14k-p4qlnn\" data-csa-c-is-in-initial-active-row=\"false\" data-csa-c-asin=\"1119502012\" data-csa-c-slot-id=\"bookDescription_feature_div\" data-csa-c-content-id=\"bookDescription\" data-csa-c-type=\"widget\" data-feature-name=\"bookDescription\" class=\"celwidget\" id=\"bookDescription_feature_div\"\u003e\n\u003cdiv class=\"a-expander-collapsed-height a-row a-expander-container a-spacing-base a-expander-partial-collapse-container\" data-a-expander-collapsed-height=\"280\" data-a-expander-name=\"book_description_expander\"\u003e\n\u003cdiv class=\"a-expander-content a-expander-partial-collapse-content\" data-expanded=\"false\"\u003e\n\u003cp\u003e\u003cstrong\u003e\u003cspan class=\"a-text-bold\"\u003eWiley Series in Quality \u0026amp; Reliability Engineering\u003c\/span\u003e\u003c\/strong\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cspan class=\"a-text-bold\"\u003eREVOLUTIONIZE YOUR APPROACH TO RELIABILITY ASSESSMENT WITH THIS GROUNDBREAKING BOOK\u003c\/span\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cspan\u003eReliability evaluation is a critical aspect of engineering, without which safe performance within desired parameters over the lifespan of machines cannot be guaranteed. With microelectronics in particular, the challenges to evaluating reliability are considerable, and statistical methods for creating microelectronic reliability standards are complex. With nano-scale microelectronic devices increasingly prominent in modern life, it has never been more important to understand the tools available to evaluate reliability.\u003c\/span\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cspan class=\"a-text-italic\"\u003eReliability Prediction for Microelectronics\u003c\/span\u003e\u003cspan\u003e meets this need with a cluster of tools built around principles of reliability physics and the concept of remaining useful life (RUL). It takes as its core subject the ‘physics of failure’, combining a thorough understanding of conventional approaches to reliability evaluation with a keen knowledge of their blind spots. It equips engineers and researchers with the capacity to overcome decades of errant reliability physics and place their work on a sound engineering footing.\u003c\/span\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cspan class=\"a-text-italic\"\u003eReliability Prediction for Microelectronics\u003c\/span\u003e\u003cspan\u003e readers will also find:\u003c\/span\u003e\u003c\/p\u003e\n\u003cul class=\"a-unordered-list a-vertical\"\u003e\n\u003cli\u003e\u003cspan class=\"a-list-item\"\u003e\u003cspan\u003eFocus on the tools required to perform reliability assessments in real operating conditions\u003c\/span\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan class=\"a-list-item\"\u003e\u003cspan\u003eDetailed discussion of topics including failure foundation, reliability testing, acceleration factor calculation, and more\u003c\/span\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003cli\u003e\u003cspan class=\"a-list-item\"\u003e\u003cspan\u003eNew multi-physics of failure on DSM technologies, including TDDB, EM, HCI, and BTI\u003c\/span\u003e\u003c\/span\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003cp\u003e\u003cspan class=\"a-text-italic\"\u003eReliability Prediction for Microelectronics\u003c\/span\u003e\u003cspan\u003e is ideal for reliability and quality engineers, design engineers, and advanced engineering students looking to understand this crucial area of product design and testing.\u003c\/span\u003e\u003c\/p\u003e\n\u003cdiv id=\"aboutauthors-section\" class=\"aboutauthors-section\"\u003e\n\u003cdiv class=\"page-section\"\u003e\n\u003cdiv data-toggle=\"collapse\" class=\"section-title collapsed\"\u003eAbout the Author\u003c\/div\u003e\n\u003cdiv class=\"section-content collapsed\"\u003e\n\u003cp\u003e\u003cb\u003eJOSEPH B. BERNSTEIN, PHD,\u003c\/b\u003e\u003cspan\u003e \u003c\/span\u003eis Director of the Laboratory for Failure Analysis and Reliability of Electronic Systems at Ariel University, Israel. He has worked and published extensively on failure analysis and defect avoidance in microelectronics, and is a senior member of IEEE.\u003c\/p\u003e\n\u003cp\u003e\u003cb\u003eALAIN A. BENSOUSSAN, PHD,\u003c\/b\u003e\u003cspan\u003e \u003c\/span\u003eis a Consulting Reliability Engineer with decades of experience as an Expert on Optics and Opto-Electronics Parts at Thales Alenia Space. He has conducted research in many areas of microelectronics reliability and physics of failure.\u003c\/p\u003e\n\u003cp\u003e\u003cb\u003eEMMANUEL BENDER, PHD,\u003c\/b\u003e\u003cspan\u003e \u003c\/span\u003ecompleted his PhD in Electrical and Electronics Engineering, specializing in Microelectronics Reliability, at Ariel University, Israel, in 2022.\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv id=\"permissions-section\" class=\"permissions-section\"\u003e\n\u003cdiv class=\"page-section\"\u003e\n\u003cdiv class=\"section-content collapsed\"\u003e\n\u003cdiv class=\"permissions-content\"\u003e\u003cbr\u003e\u003c\/div\u003e\n\u003cdiv class=\"permissions-content\"\u003e\u003cbr\u003e\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv id=\"tableofcontents-section\" class=\"tableofcontents-section\"\u003e\n\u003cdiv class=\"page-section\"\u003e\n\u003cdiv data-toggle=\"collapse\" class=\"section-title collapsed\"\u003eTable of Contents\u003c\/div\u003e\n\u003cdiv class=\"section-content collapsed\"\u003e\n\u003cp\u003eAuthor Biography xiii\u003c\/p\u003e\n\u003cp\u003eSeries Foreword xv\u003c\/p\u003e\n\u003cp\u003ePreface xix\u003c\/p\u003e\n\u003cp\u003eScope xxi\u003c\/p\u003e\n\u003cp\u003eIntroduction xxiii\u003c\/p\u003e\n\u003cp\u003e\u003cb\u003e1 Conventional Electronic System Reliability Prediction 1\u003c\/b\u003e\u003c\/p\u003e\n\u003cp\u003e1.1 Electronic Reliability Prediction Methods 2\u003c\/p\u003e\n\u003cp\u003e1.2 Electronic Reliability in Manufacturing, Production, and Operations 27\u003c\/p\u003e\n\u003cp\u003e1.3 Reliability Criteria 34\u003c\/p\u003e\n\u003cp\u003e1.4 Reliability Testing 42\u003c\/p\u003e\n\u003cp\u003e\u003cb\u003e2 The Fundamentals of Failure 55\u003c\/b\u003e\u003c\/p\u003e\n\u003cp\u003e2.1 The Random Walk 56\u003c\/p\u003e\n\u003cp\u003e2.2 Diffusion 61\u003c\/p\u003e\n\u003cp\u003e2.3 Solutions for the Diffusion Equation 63\u003c\/p\u003e\n\u003cp\u003e2.4 Drift 69\u003c\/p\u003e\n\u003cp\u003e2.5 Statistical Mechanics 70\u003c\/p\u003e\n\u003cp\u003e2.6 Chemical Potential 74\u003c\/p\u003e\n\u003cp\u003e2.7 Thermal Activation Energy 77\u003c\/p\u003e\n\u003cp\u003e2.8 Oxidation and Corrosion 81\u003c\/p\u003e\n\u003cp\u003e2.9 Vibration 85\u003c\/p\u003e\n\u003cp\u003e2.10 Summary 89\u003c\/p\u003e\n\u003cp\u003e\u003cb\u003e3 Physics-of-Failure-based Circuit Reliability 91\u003c\/b\u003e\u003c\/p\u003e\n\u003cp\u003e3.1 Problematic Areas 92\u003c\/p\u003e\n\u003cp\u003e3.2 Reliability of Complex Systems 113\u003c\/p\u003e\n\u003cp\u003e3.3 Physics-of-Failure-based Circuit Reliability Prediction Methodology 119\u003c\/p\u003e\n\u003cp\u003e\u003cb\u003e4 Transition State Theory 133\u003c\/b\u003e\u003c\/p\u003e\n\u003cp\u003e4.1 Stress-Related Failure Mechanisms 134\u003c\/p\u003e\n\u003cp\u003e4.2 Non-Arrhenius Model Parameters 138\u003c\/p\u003e\n\u003cp\u003e4.3 Physics of Healthy 171\u003c\/p\u003e\n\u003cp\u003e\u003cb\u003e5 Multiple Failure Mechanism in Reliability Prediction 179\u003c\/b\u003e\u003c\/p\u003e\n\u003cp\u003e5.1 MTOL Testing System 183\u003c\/p\u003e\n\u003cp\u003e5.2 MTOL Matrix: A Use Case Application 191\u003c\/p\u003e\n\u003cp\u003e5.3 Comparison of DSM Technologies (45, 28, and 20 nm) 200\u003c\/p\u003e\n\u003cp\u003e5.4 16 nm FinFET Reliability Profile Using the MTOL Method 204\u003c\/p\u003e\n\u003cp\u003e5.5 16 nm Microchip Health Monitoring (MHM) from MTOL Reliability 215\u003c\/p\u003e\n\u003cp\u003e\u003cb\u003e6 System Reliability 229\u003c\/b\u003e\u003c\/p\u003e\n\u003cp\u003e6.1 Definitions 230\u003c\/p\u003e\n\u003cp\u003e6.2 Series Systems 232\u003c\/p\u003e\n\u003cp\u003e6.3 Weibull Analysis of Data 241\u003c\/p\u003e\n\u003cp\u003e6.4 Weibull Analysis to Correlate Process Variations and BTI Degradation 247\u003c\/p\u003e\n\u003cp\u003e\u003cb\u003e7 Device Failure Mechanism 255\u003c\/b\u003e\u003c\/p\u003e\n\u003cp\u003e7.1 Time-Dependent Dielectric Breakdown 257\u003c\/p\u003e\n\u003cp\u003e7.2 Hot Carrier Injection 265\u003c\/p\u003e\n\u003cp\u003e7.3 Negative Bias Temperature Instability 276\u003c\/p\u003e\n\u003cp\u003e7.4 Electromigration 282\u003c\/p\u003e\n\u003cp\u003e7.5 Soft Errors due to Memory Alpha Particles 285\u003c\/p\u003e\n\u003cp\u003e\u003cb\u003e8 Reliability Modeling of Electronic Packages 289\u003c\/b\u003e\u003c\/p\u003e\n\u003cp\u003e8.1 Failure Mechanisms of Electronic Packages 293\u003c\/p\u003e\n\u003cp\u003e8.2 Failure Mechanisms’ Description and Models 297\u003c\/p\u003e\n\u003cp\u003e8.3 Failure Models 310\u003c\/p\u003e\n\u003cp\u003e8.4 Electromigration 315\u003c\/p\u003e\n\u003cp\u003e8.5 Corrosion Failure 317\u003c\/p\u003e\n\u003cp\u003e8.6.1 Creep 322\u003c\/p\u003e\n\u003cp\u003e8.7 Reliability Prediction of Electronic Packages 325\u003c\/p\u003e\n\u003cp\u003e8.8 Reliability Failure Models 325\u003c\/p\u003e\n\u003cp\u003eReferences 331\u003c\/p\u003e\n\u003cp\u003eIndex 363\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cp\u003e\u003cstrong\u003e\u003cb\u003eBOOKREAD™ 5-STEP SATISFACTION GUARANTEE\u003c\/b\u003e\u003c\/strong\u003e\u003cbr\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cspan\u003e\u003cstrong\u003e1. No Risk, 30-Day Money-Back Guarantee. \u003cbr\u003e2. instant download. No surprises or hidden fees.\u003cbr\u003e3. Safe Payments via Credit\/Debit Card or PayPal® \u003cbr\u003e4. McAfee™ and SSL secured shopping cart.\u003cbr\u003e5. lifetime customer support.\u003c\/strong\u003e\u003c\/span\u003e\u003c\/p\u003e\n\u003cp\u003e \u003c\/p\u003e\n\u003c!----\u003e","brand":"bookread","offers":[{"title":"PDF","offer_id":56754830541131,"sku":null,"price":29.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/1031\/1204\/8971\/files\/810g96j_3SL._SL1500.jpg?v=1773064351","url":"https:\/\/bookread.io\/products\/reliability-prediction-for-microelectronics-quality-and-reliability-engineering-series-1st-edition","provider":"bookread","version":"1.0","type":"link"}